Inventor
Anup PANCHOLI
Inventor
US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10HInorganic light-emitting semiconductor devices having potential barriers14%
H10BElectronic memory devices6%
H10KOrganic electric solid-state devices6%
H10DInorganic electric semiconductor devices5%
G02BOptical elements, systems or apparatus3%
G09FDisplaying2%
G09GArrangements or circuits for control of indicating devices using static means to present variable information2%
PatentTitleYear
12,487,417Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit202512,463,180Monolithic chip stacking using a die with double-sided interconnect layers202512,444,707Method for collective dishing of singulated dies202512,389,728Micro-LED displays including solder structures and methods202512,362,325Monolithic chip stacking using a die with double-sided interconnect layers202512,345,934Methods for fabrication of optical structures on photonic glass layer substrates202511,948,831Apparatus with multi-wafer based device and method for forming such202411,908,981Laser printing of color converter devices on micro led display devices and methods202411,908,687III-N multichip modules and methods of fabrication202411,784,165Monolithic chip stacking using a die with double-sided interconnect layers202311,659,722Thin-film-transistor based complementary metal-oxide-semiconductor (CMOS) circuit202311,637,093Micro light-emitting diode display fabrication and assembly202311,610,936Micro light-emitting diode displays having color conversion devices and assembly approaches202311,527,683Laser printing of color converter devices on micro LED display devices and methods202211,251,158Monolithic chip stacking using a die with double-sided interconnect layers202211,245,053Micro-LED structures for full color displays and methods of manufacturing the same202211,211,245III-N multichip modules and methods of fabrication202111,177,243Micro light-emitting diode display fabrication and assembly2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to INTEL CORP (13)· patent assignee history
2021–2025Based in US· patent location history
2022–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2025Patents assigned to APPLIED MATERIALS INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 13 | 2021–2025 |
| APPLIED MATERIALS INC | 3 | 2025 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 18 | 2021–2025 |