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Inventor

Tun-Chih Shih

Inventor
New Taipei, TW

Overview

3→
Patents
2000–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
10,643,968Vertically die-stacked bonder and method using the same202010,438,917Vertically die-stacked bonder and method using the same20196,132,161'Chip supplying apparatus performing stable blue-film-expansion operation'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000Patents assigned to IND TECH RES INST (1)· patent assignee history
2000Based in Hsinchu, TW· patent location history
2019–2020Patents assigned to GALLANT MICRO MACHINING CO LTD (2)· patent assignee history
2019–2020Based in New Taipei, TW· patent location history
2020Patents assigned to GALLANT MICRO MACHNING CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GALLANT MICRO MACHINING CO LTD22019–2020
GALLANT MICRO MACHNING CO LTD12020
IND TECH RES INST12000
Locations
LocationPatentsSpan
New Taipei, TW22019–2020
Hsinchu, TW12000