Inventor

HSIU-JEN LIN

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 67 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%

B23KSoldering or unsoldering4%

G02BOptical elements, systems or apparatus3%

H10DInorganic electric semiconductor devices3%

H05KPrinted circuits1%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%

H05BElectric heating1%

Y10TTechnical subjects covered by former us classification1%

PatentTitleYear

12,581,977Bonding through multi-shot laser reflow2026 12,564,055Package structure and method of fabricating the same2026 12,564,054Package structure2026 12,564,008Method and treatment system for uniform processing of semiconductor devices2026 12,543,612Semiconductor devices and methods of forming the same2026 12,538,827Semiconductor structure2026 12,512,451Semiconductor package and manufacturing method of the same2025 12,500,219Trimming and sawing processes in the formation of wafer-form packages2025 12,489,030Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure2025 12,431,446Package structure2025 12,417,927Semiconductor device and method of manufacture2025 12,406,961Integrated circuit package and method2025 12,388,060Integrated fan-out packages and methods of forming the same2025 12,388,041Semiconductor package2025 12,374,627Method of fabricating semiconductor structure2025 12,368,149Methods of forming semiconductor packages2025 12,368,086Package structure having thermoelectric cooler2025 12,368,053Method for laser drilling process for an integrated circuit package2025 12,300,652Substrate and package structure2025 12,266,673Semiconductor package and method of forming the same2025 12,266,559Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece2025 12,261,092Semiconductor package and manufacturing method thereof2025 12,261,088Package structure and method of forming the same2025 12,230,597Package structure with warpage-control element2025 12,176,319Reflow method and system2024 12,176,282Manufacturing method of semiconductor package2024 12,159,839Semiconductor packages2024 12,144,065Warpage control in the packaging of integrated circuits2024 12,142,594Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices2024 12,119,238Semiconductor bonding structures and methods2024 12,107,064Semiconductor package and manufacturing method thereof2024 12,086,103Intelligent storage system and an intelligent storage method thereof2024 12,051,639Package structure and manufacturing method thereof2024 12,051,655Package structure and method of forming the same2024 12,040,309Bonding through multi-shot laser reflow2024 12,040,283Method of fabricating semiconductor structure2024 12,009,322Package structure with through-via in molding compound and dielectric layer2024 11,996,400Manufacturing method of package on package structure2024 11,942,464Semiconductor package and method2024 11,942,451Semiconductor structure and method of forming the same2024 11,901,258Iintegrated fan-out packages with embedded heat dissipation structure2024 11,894,332Substrate and package structure2024 11,874,513Package structure2024 11,862,577Package structure and method of fabricating the same2024 11,830,746Semiconductor device and method of manufacture2023 11,830,781Package structure and manufacturing method thereof2023 11,791,192Workpiece holder, wafer chuck, wafer holding method2023 11,749,535Semiconductor bonding structures and methods2023 11,721,659Package structure with warpage-control element2023 11,664,325Semiconductor structure and method of fabricating the same2023 11,664,300Fan-out packages and methods of forming the same2023 11,646,293Semiconductor structure and method2023 11,640,935Semiconductor package and manufacturing method thereof2023 11,610,859Reflow method and system2023 11,585,992Package structure2023 11,515,274Semiconductor package and manufacturing method thereof2022 11,502,039Semiconductor package and method2022 11,482,491Package structure with porous conductive structure and manufacturing method thereof2022 11,462,507Bonding through multi-shot laser reflow2022 11,432,372Warpage control in the packaging of integrated circuits2022 11,417,698Semiconductor package and method of forming the same2022 11,355,471System for processing semiconductor devices2022 11,342,321Manufacturing method of package on package structure2022 11,309,294Integrated fan-out packages and methods of forming the same2022 11,251,141Package structure2022 11,244,906Semiconductor structure and method of fabricating the same2022 11,211,341Package structure and method of fabrcating the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (66)· patent assignee history

2021–2026Based in TW· patent location history

2024Patents assigned to LIN HSIU JEN (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	66	2021–2026
LIN HSIU JENself	1	2024

Locations

Location	Patents	Span
TW	67	2021–2026