LexDanaLexDanabeta
Inventor

How Kiat Liew

Inventor
Bukit Jalil, MY

Overview

5→
Patents
2016–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10DInorganic electric semiconductor devices13%
PatentTitleYear
10,825,754Quad flat no leads package with locking feature202010,763,173Thin semiconductor package and related methods202010,319,639Thin semiconductor package and related methods20199,748,163'Die support for enlarging die size'20179,281,258'Chip scale packages and related methods'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to SEMICONDUCTOR COMPONENTS IND (1)· patent assignee history
2016–2020Based in Ipoh, MY· patent location history
2017–2020Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (4)· patent assignee history
2017–2020Based in Bukit Jalil, MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMICONDUCTOR COMPONENTS IND LLC42017–2020
SEMICONDUCTOR COMPONENTS IND12016
Locations
LocationPatentsSpan
Bukit Jalil, MY32017–2020
Ipoh, MY22016–2020