Inventor
Kaoru Hosokawa
Inventor
Saitama, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
G06FElectric digital data processing22%
B60WConjoint control of vehicle sub-units of different type or different function11%
G01CMeasuring distances, levels or bearings11%
G08GTraffic control systems11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
10,540,895Management of mobile objects202010,474,698System, method, and program for performing aggregation process for each piece of received data20195,490,811'Apparatus for chamfering notch of wafer'19965,445,554'Method for chamfering notch of wafer and apparatus therefor'19955,271,185'Apparatus for chamfering notch of wafer'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–1996Patents assigned to SHINETSU HANDOTAI KK (3)· patent assignee history
1993–1996Based in Saitama, JP· patent location history
2019–2020Patents assigned to IBM (2)· patent assignee history
2019–2020Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU HANDOTAI KK | 3 | 1993–1996 |
| IBM | 2 | 2019–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saitama, JP | 3 | 1993–1996 |
| Tokyo, JP | 2 | 2019–2020 |