Inventor
Chin Hui Chong
Inventor
Singapore, SG
Overview
Patents· 68 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H01LSemiconductor devices17%
Y10TTechnical subjects covered by former us classification10%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G06FElectric digital data processing3%
A47JKitchen equipment2%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering2%
C12CBeer2%
H01RElectrically-conductive connections2%
PatentTitleYear
11,129,491Beverage-making apparatus202111,129,490Beverage-making apparatus202111,111,467Beverage making apparatus202110,861,824Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices202010,593,607Build-up package for integrated circuit devices, and methods of making same202010,448,509Electronic device assemblies including conductive vias having two or more conductive elements201910,431,513Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices201910,211,114Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices201910,153,254Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices201810,008,468Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices20189,768,121'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices'20179,721,874'Pre-encapsulated lead frames for microelectronic device packages, and associated methods'20179,640,458'Stacked microelectronic devices'20179,583,476'Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices'20179,530,748'Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices'20169,362,260'Stacked packaged integrated circuit devices, and methods of making same'20169,362,141'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices'20169,355,992'Land grid array semiconductor device packages'20169,355,994'Build-up package for integrated circuit devices, and methods of making same'20169,299,684'Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices'20169,271,403'Semiconductor assemblies with multi-level substrates and associated methods of manufacturing'20169,142,427'Methods of making an interposer structure with embedded capacitor structure'20159,084,360'Electronic device assemblies including conductive vias having two or more conductive elements'20158,975,745'Packaged microelectronic devices recessed in support member cavities, and associated methods'20158,963,302'Stacked packaged integrated circuit devices, and methods of making same'20158,940,581'Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices'20158,869,387'Methods for making microelectronic die systems'20148,823,159'Stacked microelectronic devices'20148,796,836'Land grid array semiconductor device packages'20148,772,947'Methods for packaging microelectronic devices and microelectronic devices formed using such methods'20148,754,537'Build-up package for integrated circuit devices, and methods of making same'20148,637,987'Semiconductor assemblies with multi-level substrates and associated methods of manufacturing'20148,519,523'Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices'20138,507,318'Method for manufacturing microelectronic devices'20138,450,839'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices'20138,445,997'Stacked packaged integrated circuit devices'20138,441,132'Packaged microelectronic devices recessed in support member cavities, and associated methods'20138,426,743'Electronic device assemblies including conductive vias having two or more conductive elements'20138,357,566'Pre-encapsulated lead frames for microelectronic device packages, and associated methods'20138,322,031'Method of manufacturing an interposer'20128,217,505'Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same'20128,203,213'Methods for packaging microelectronic devices and microelectronic devices formed using such methods'20128,202,754'Packaged microelectronic devices recessed in support member cavities, and associated methods'20128,148,807'Packaged microelectronic devices and associated systems'20128,138,021'Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components'20128,115,112'Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates'20128,106,491'Methods of forming stacked semiconductor devices with a leadframe and associated assemblies'20128,030,748'Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices'20118,030,751'Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates'20117,915,077'Methods of making metal core foldover package structures'20117,915,726'Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices'20117,888,185'Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device'20117,767,913'Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods'20107,759,221'Methods for packaging microelectronic devices and microelectronic devices formed using such methods'20107,759,785'Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components'20107,749,808'Stacked microelectronic devices and methods for manufacturing microelectronic devices'20107,745,920'Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices'20107,692,931'Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods'20107,671,459'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices'20107,557,443'Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices'20097,504,284'Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices'20097,485,969'Stacked microelectronic devices and methods for manufacturing microelectronic devices'20097,465,607'Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package'20087,435,913'Slanted vias for electrical circuits on circuit boards and other substrates'20087,425,758'Metal core foldover package structures'20087,326,591'Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices'20087,291,900'Lead frame-based semiconductor device packages incorporating at least one land grid array package'20077,083,425'Slanted vias for electrical circuits on circuit boards and other substrates'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2020Patents assigned to MICRON TECHNOLOGY INC (64)· patent assignee history
2006–2020Based in Singapore, SG· patent location history
2012–2016Patents assigned to CHONG CHIN HUI (22)· patent assignee history
2012–2016Patents assigned to LEE CHOON KUAN (19)· patent assignee history
2012–2016Patents assigned to CORISIS DAVID J (17)· patent assignee history
2021Patents assigned to LG ELECTRONICS INC (3)· patent assignee history
2021Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 64 | 2006–2020 |
| CHONG CHIN HUIself | 22 | 2012–2016 |
| LEE CHOON KUAN | 19 | 2012–2016 |
| CORISIS DAVID J | 17 | 2012–2016 |
| LG ELECTRONICS INC | 3 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 65 | 2006–2020 |
| Seoul, KR | 3 | 2021 |