Inventor

Akihiro Yaguchi

Inventor

Ibaraki, JP

Overview

1990–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 69 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%

H05KPrinted circuits20%

H10DInorganic electric semiconductor devices16%

Y10TTechnical subjects covered by former us classification8%

Y02PClimate change mitigation technologies in the production or processing of goods3%

H01RElectrically-conductive connections2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1%

C08LCompositions of macromolecular compounds1%

C09JAdhesives1%

G01CMeasuring distances, levels or bearings1%

PatentTitleYear

9,964,560Transfer mold type sensor device2018 8,878,062'Cable connection structure and cable connection method'2014 8,308,503'Flat cable and connection structure between flat cable and printed wiring board'2012 8,282,412'Flat cable and connection structure between flat cable and printed wiring board'2012 7,572,674'Method for manufacturing semiconductor device'2009 7,388,295'Multi-chip module'2008 7,038,322'Multi-chip module'2006 6,927,489'Semiconductor device provided with rewiring layer'2005 6,919,622'Semiconductor device'2005 6,844,219'Semiconductor device and lead frame therefor'2005 6,777,816'Multi-chip module'2004 6,720,208'Semiconductor device'2004 6,696,765'Multi-chip module'2004 6,639,315'Semiconductor device and mounted semiconductor device structure'2003 6,621,154'Semiconductor apparatus having stress cushioning layer'2003 6,531,760'Semiconductor device'2003 6,512,176'Semiconductor device'2003 6,465,876'Semiconductor device and lead frame therefor'2002 6,452,256'Semiconductor device'2002 RE037690'Lead frame and semiconductor device'2002 6,348,741'Semiconductor apparatus and a manufacturing method thereof'2002 6,340,793'Semiconductor device'2002 6,326,681'Semiconductor device'2001 6,303,982'Semiconductor device'2001 6,297,073'Semiconductor device'2001 6,232,653'TSOP type semiconductor device'2001 6,204,552'Semiconductor device'2001 6,130,112'Semiconductor device'2000 6,130,114'Semiconductor device'2000 6,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'2000 6,100,580'Semiconductor device having all outer leads extending from one side of a resin member'2000 6,100,115'Semiconductor device'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,069,029'Semiconductor device chip on lead and lead on chip manufacturing'2000 6,049,128'Semiconductor device'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,530'Semiconductor device'1999 5,895,965'Semiconductor device'1999 5,863,817'Semiconductor device'1999 5,837,567'Lead frame and semiconductor device'1998 5,821,606'Semiconductor device'1998 5,793,099'Semiconductor device'1998 5,637,914'Lead frame and semiconductor device encapsulated by resin'1997 5,612,569'Semiconductor device'1997 5,608,265'Encapsulated semiconductor device package having holes for electrically conductive material'1997 5,571,428'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1996 5,569,960'Electronic component, electronic component assembly and electronic component unit'1996 5,539,250'Plastic-molded-type semiconductor device'1996 5,530,286'Semiconductor device'1996 5,437,915'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1995 5,358,904'Semiconductor device'1994 5,357,139'Plastic encapsulated semiconductor device and lead frame'1994 5,347,429'Plastic-molded-type semiconductor device'1994 5,299,092'Plastic sealed type semiconductor apparatus'1994 5,296,737'Semiconductor device with a plurality of face to face chips'1994 5,295,045'Plastic-molded-type semiconductor device and producing method therefor'1994 5,293,068'Semiconductor device'1994 5,256,903'Plastic encapsulated semiconductor device'1993 5,229,643'Semiconductor apparatus and semiconductor package'1993 5,194,935'Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure'1993 5,159,434'Semiconductor device having a particular chip pad structure'1992 5,101,263'Semiconductor device and method for manufacturing the same'1992 5,068,712'Semiconductor device'1991 5,047,837'Semiconductor device with heat transfer cap'1991 5,041,901'Lead frame and semiconductor device using the same'1991 4,987,474'Semiconductor device and method of manufacturing the same'1991 4,942,452'Lead frame and semiconductor device'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–2006Patents assigned to HITACHI LTD (58)· patent assignee history

1990–2005Based in Ibaraki, JP· patent location history

1991–2005Based in Chiyoda-ku, JP· patent location history

1991–2000Based in Shimoinayoshi, JP· patent location history

2002–2008Based in Iwama, JP· patent location history

2004–2009Patents assigned to RENESAS TECH CORP (6)· patent assignee history

2012–2014Patents assigned to YAGUCHI AKIHIRO (3)· patent assignee history

2012Patents assigned to HITACHI CABLE (2)· patent assignee history

2012Patents assigned to KOBAYASHI TAKUMI (2)· patent assignee history

2012–2014Based in Kasama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	58	1990–2006
RENESAS TECH CORP	6	2004–2009
YAGUCHI AKIHIROself	3	2012–2014
HITACHI CABLE	2	2012
KOBAYASHI TAKUMI	2	2012

Locations

Location	Patents	Span
Ibaraki, JP	26	1990–2005
Chiyoda-ku, JP	14	1991–2005
Iwama, JP	10	2002–2008
Shimoinayoshi, JP	9	1991–2000
Kasama, JP	3	2012–2014