Inventor
John W. Stafford
Inventor
Phoenix, AZ, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits13%
G02BOptical elements, systems or apparatus10%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light10%
B64FGround or aircraft-carrier-deck installations specially adapted for use in connection with aircraft6%
B64UUnmanned aerial vehicles [uav]6%
B64CAeroplanes4%
H10HInorganic light-emitting semiconductor devices having potential barriers4%
B23KSoldering or unsoldering3%
B64DEquipment for fitting in or to aircraft3%
PatentTitleYear
10,843,817Systems and methods for recovering and controlling post-recovery motion of unmanned aircraft20209,944,408Systems and methods for recovering and controlling post-recovery motion of unmanned aircraft20189,004,402'Method and apparatus for automated launch, retrieval, and servicing of a hovering aircraft'20158,573,536'Method and apparatus for automated launch, retrieval, and servicing of a hovering aircraft'20137,125,176'PCB with embedded optical fiber'20065,905,750'Semiconductor laser package and method of fabrication'19995,892,661'Smartcard and method of making'19995,838,703'Semiconductor laser package with power monitoring system and optical element'19985,818,404'Integrated electro-optical package'19985,816,478'Fluxless flip-chip bond and a method for making'19985,789,815'Three dimensional semiconductor package having flexible appendages'19985,739,800'Integrated electro-optical package with LED display chip and substrate with drivers and central opening'19985,699,073'Integrated electro-optical package with carrier ring and method of fabrication'19975,689,279'Integrated electro-optical package'19975,650,640'Integrated electro-optic package'19975,627,931'Optoelectronic transducer'19975,612,549'Integrated electro-optical package'19975,602,491'Integrated circuit testing board having constrained thermal expansion characteristics'19975,446,247'Electrical contact and method for making an electrical contact'19955,432,358'Integrated electro-optical package'19955,221,426'Laser etch-back process for forming a metal feature on a non-metal substrate'19935,217,597'Solder bump transfer method'19935,194,137'Solder plate reflow method for forming solder-bumped terminals'19935,160,409'Solder plate reflow method for forming a solder bump on a circuit trace intersection'19925,120,678'Electrical component package comprising polymer-reinforced solder bump interconnection'19924,997,279'Optical bench for a semiconductor laser and method'19914,818,053'Optical bench for a semiconductor laser and method'19894,762,386'Optical fiber assembly including means utilizing a column load to compensate for thermal effects'19884,762,395'Lens assembly for optical coupling with a semiconductor laser'19884,752,109'Optoelectronics package for a semiconductor laser'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1991Patents assigned to AMP INC (5)· patent assignee history
1988–1991Based in Summit, NJ, US· patent location history
1992–1999Patents assigned to MOTOROLA INC (20)· patent assignee history
1992–1993Based in St. Charles, IL, US· patent location history
1995–2006Based in Phoenix, AZ, US· patent location history
2013–2015Patents assigned to AEROVEL CORP (2)· patent assignee history
2013–2020Based in Lyle, WA, US· patent location history
2018–2020Patents assigned to INSITU INC (2)· patent assignee history
2018Patents assigned to DENNIS BRIAN D (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 20 | 1992–1999 |
| AMP INC | 5 | 1988–1991 |
| AEROVEL CORP | 2 | 2013–2015 |
| INSITU INC | 2 | 2018–2020 |
| DENNIS BRIAN D | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 16 | 1995–2006 |
| St. Charles, Illinois, US | 5 | 1992–1993 |
| Summit, New Jersey, US | 5 | 1988–1991 |
| Lyle, Washington, US | 4 | 2013–2020 |