Inventor
Federico Giovanni Ziglioli
Inventor
Pozzo d'Adda, IT
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices21%
B81BMicrostructural devices or systems, e.g. micromechanical devices9%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
H05KPrinted circuits4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers3%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
11,133,242Method of manufacturing semiconductor devices, corresponding device and circuit202110,971,375Method of manufacturing semiconductor devices and corresponding semiconductor device202110,964,646IC with insulating trench and related methods202110,930,581Semiconductor package with wettable flank202110,879,143Method of manufacturing semiconductor devices, corresponding device and circuit202010,861,760Method of manufacturing semiconductor devices and corresponding semiconductor device202010,818,578Method of manufacturing semiconductor devices, corresponding device and circuit202010,794,783Pressure sensing device with cavity and related methods202010,770,432ASICS face to face self assembly202010,756,005Semiconductor device, corresponding circuit and method202010,707,153Semiconductor device having die pad202010,598,578Tensile stress measurement device with attachment plates and related methods202010,529,653Electronic components with integral lead frame and wires202010,504,806Semiconductor package with electrical test pads201910,497,655Methods, circuits and systems for a package structure having wireless lateral connections201910,483,238Ink printed wire bonding201910,468,344Method of manufacturing semiconductor devices and corresponding product201910,455,692Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof201910,424,525Method of manufacturing semiconductor devices201910,294,096Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby201910,153,229Method of manufacturing semiconductor products, corresponding semiconductor product and device201810,121,720Semiconductor device, corresponding apparatus and method20189,939,338Pressure sensing device with cavity and related methods20189,922,945'Methods, circuits and systems for a package structure having wireless lateral connections'20189,887,165'IC with insulating trench and related methods'2018RE046671'Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device'20189,859,256'Ink printed wire bonding'20189,791,303'Package, made of building material, for a parameter monitoring device, within a solid structure, and relative device'20179,761,511'Electronic components with integral lead frame and wires'20179,736,925'Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof'20179,726,587'Tensile stress measurement device with attachment plates and related methods'20179,708,174'Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained thereby'20179,640,506'Method for manufacturing electronic devices'20179,464,952'Integrated electronic device for monitoring mechanical stress within a solid structure'20169,318,313'Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structure'20169,188,683'Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography'20159,187,310'Wafer-level packaging of a MEMS integrated device and related manufacturing process'20159,180,451'Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses'20159,096,421'Stacked assembly of a MEMS integrated device having a reduced thickness'20159,099,453'Methods, circuits and systems for a package structure having wireless lateral connections'20159,011,776'Packaged device exposed to environmental air and liquids and manufacturing method thereof'20158,981,498'Electronic MEMS device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof'20158,978,483'Integrated electronic device for detecting a local parameter related to a force experienced in a predetermined direction, within a solid structure'20158,967,000'Planar electric board with pliable wings and system for sensing components along three coordinate axis of inner forces in a block made of a building material'20158,854,830'Semiconductor package substrate in particular for MEMS devices'20148,800,391'Piezo-resistive force sensor with bumps on membrane structure'20148,633,583'Semiconductor package substrate and methods for forming same, in particular for MEMS devices'20148,499,613'Integrated chemical sensor for detecting odorous matters'20138,411,457'Semiconductor package substrate'20138,324,007'Manufacturing method of an electronic device including overmolded MEMS devices'20128,049,287'Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device'20117,998,774'Package, in particular for MEMS devices and method of making same'20117,898,043'Package, in particular for MEMS devices and method of making same'20117,616,451'Semiconductor package substrate and method, in particular for MEMS devices'20097,421,904'Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2021Patents assigned to ST MICROELECTRONICS SRL (53)· patent assignee history
2008–2013Based in Gessate, IT· patent location history
2012–2015Patents assigned to ZIGLIOLI FEDERICO GIOVANNI (7)· patent assignee history
2012–2015Patents assigned to SHAW MARK ANDREW (3)· patent assignee history
2013–2015Patents assigned to BARLOCCHI GABRIELE (2)· patent assignee history
2013–2014Patents assigned to GRAZIOSI GIOVANNI (2)· patent assignee history
2013–2021Based in Pozzo d'Adda, IT· patent location history
2014Based in Via Adamello, IT· patent location history
2014Based in Milan, IT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS SRL | 53 | 2008–2021 |
| ZIGLIOLI FEDERICO GIOVANNIself | 7 | 2012–2015 |
| SHAW MARK ANDREW | 3 | 2012–2015 |
| BARLOCCHI GABRIELE | 2 | 2013–2015 |
| GRAZIOSI GIOVANNI | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pozzo d'Adda, IT | 46 | 2013–2021 |
| Gessate, IT | 7 | 2008–2013 |
| Via Adamello, IT | 1 | 2014 |
| Milan, IT | 1 | 2014 |