Inventor
SHINJI TSUCHIKAWA
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%
C08JWorking-up14%
H05KPrinted circuits14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients10%
C08LCompositions of macromolecular compounds10%
H01LSemiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,168,709Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module202411,581,212Prepreg for coreless substrate, coreless substrate and semiconductor package202311,214,660Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to HITACHI CHEMICAL CO LTD (2)· patent assignee history
2022–2023Patents assigned to SHOWA DENKO MATERIALS CO LTD (2)· patent assignee history
2022–2024Based in JP· patent location history
2024Patents assigned to RESONAC CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 2 | 2022–2023 |
| SHOWA DENKO MATERIALS CO LTD | 2 | 2022–2023 |
| RESONAC CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2022–2024 |