Inventor
Mark E. Schlarmann
Inventor
Chandler, AZ, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices16%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock8%
G01CMeasuring distances, levels or bearings5%
G01DMeasuring not specially adapted for a specific variable5%
G01RMeasuring electric variables5%
H01GCapacitors3%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner3%
PatentTitleYear
10,260,981Pressure sensor having sense elements in multiple wheatstone bridges with chained outputs20199,927,266'Multi-chip device with temperature control element for temperature calibration'20189,818,656'Devices and methods for testing integrated circuit devices'20179,297,826'System and method for monitoring an accelerometer'20169,285,422'Tester and method for testing a strip of devices'20169,190,937'Stiction resistant mems device and method of operation'20159,157,945'Electro-mechanical oscillator and common-mode detection circuit'20159,131,325'MEMS device assembly and method of packaging same'20159,116,165'Microelectromechanical system package and method of testing'20159,118,334'System and method for improved MEMS oscillator startup'20159,109,901'System and method for monitoring a gyroscope'20159,103,845'System and method for reducing offset variation in multifunction sensor devices'20159,090,455'MEMS pressure transducer assembly'20158,889,451'MEMS pressure transducer assembly and method of packaging same'20148,487,387'MEMS sensor device with multi-stimulus sensing'20138,316,718'MEMS pressure sensor device and method of fabricating same'20128,304,275'MEMS device assembly and method of packaging same'20128,216,882'Method of producing a microelectromechanical (MEMS) sensor device'20128,178,942'Electrically alterable circuit for use in an integrated circuit device'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (16)· patent assignee history
2012–2018Patents assigned to SCHLARMANN MARK E (12)· patent assignee history
2012–2018Patents assigned to LIN YIZHEN (6)· patent assignee history
2012–2015Patents assigned to DESAI HEMANT D (4)· patent assignee history
2012–2019Based in Chandler, AZ, US· patent location history
2015Based in Austin, TX, US· patent location history
2017–2019Patents assigned to NXP USA INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 16 | 2012–2016 |
| SCHLARMANN MARK Eself | 12 | 2012–2018 |
| LIN YIZHEN | 6 | 2012–2018 |
| DESAI HEMANT D | 4 | 2012–2015 |
| NXP USA INC | 3 | 2017–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 18 | 2012–2019 |
| Austin, Texas, US | 1 | 2015 |