Inventor
Youiti Machii
Inventor
Tsuchiura, JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions33%
C09KMaterials for miscellaneous applications, not provided for elsewhere33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
8,002,860'CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive'20117,410,409'Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2011Patents assigned to HITACHI CHEMICAL CO LTD (2)· patent assignee history
2008–2011Based in Tsuchiura, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 2 | 2008–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsuchiura, JP | 2 | 2008–2011 |