Inventor
David W. Staines
Inventor
Portland, OR, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H05KPrinted circuits11%
A41DOuterwear6%
A43BCharacteristic features of footwear6%
B23BTurning6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
10,468,357Stretchable electronics fabrication method with strain redistribution layer201910,204,855Bendable and stretchable electronic devices and methods201910,206,277Gradient encapsulant protection of devices in stretchable electronics20197,087,538'Method to fill the gap between coupled wafers'20066,734,118'Dielectric material treatment'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2019Patents assigned to INTEL CORP (5)· patent assignee history
2004–2019Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2004–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 5 | 2004–2019 |