Inventor
Scott Estes
Inventor
Austin, TX, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01RElectrically-conductive connections9%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
5,946,544'Circuit board-mounted IC package cooling and method'19995,714,789'Circuit board-mounted IC package cooling apparatus'19985,625,227'Circuit board-mounted IC package cooling apparatus'19975,613,858'Compact circuit board switching apparatus and associated methods'19975,392,980'Method and apparatus for reworking ball grid array packages to allow reuse of functional devices'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–1999Patents assigned to DELL USA LP (5)· patent assignee history
1995–1999Based in Austin, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DELL USA LP | 5 | 1995–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 5 | 1995–1999 |