Inventor
Yoshihide Yamaguchi
Inventor
Fujisawa, JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification8%
H10DInorganic electric semiconductor devices4%
B23KSoldering or unsoldering3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H01LSemiconductor devices3%
H10BElectronic memory devices3%
B01DSeparation1%
PatentTitleYear
11,099,037Magnetic encoder and production method therefor202110,460,953Semiconductor manufacturing apparatus for manufacturing a semiconductor device having a high-K insulating film, and a method for manufacturing the semiconductor device20199,001,528'Shielded electronic components and method of manufacturing the same'20158,992,665'Metal recovery method and dialysis device'20157,839,484'Exposure apparatus and exposure method, and method of manufacturing electrical wiring board'20107,760,328'Exposure apparatus and exposing method and method of manufacturing a printed wiring board'20107,569,967'Compact disk device and disk drive'20097,459,201'Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board'20087,378,333'Semiconductor device and manufacturing method thereof'20087,084,498'Semiconductor device having projected electrodes and structure for mounting the same'20067,057,283'Semiconductor device and method for producing the same'20067,002,250'Semiconductor module'20066,998,713'Wiring board and method for producing same'20066,949,416'Method of manufacturing a semiconductor integrated circuit device'20056,946,327'Semiconductor device and manufacturing method of that'20056,946,723'Semiconductor device and manufacturing method thereof'20056,930,388'Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure'20056,861,742'Wafer level chip size package having rerouting layers'20056,822,317'Semiconductor apparatus including insulating layer having a protrusive portion'20046,791,178'Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices'20046,780,748'Method of fabricating a wafer level chip size package utilizing a maskless exposure'20046,770,547'Method for producing a semiconductor device'20046,756,688'Wiring board and its production method, semiconductor device and its production method, and electronic apparatus'20046,720,591'Semiconductor integrated circuit device'20046,695,200'Method of producing electronic part with bumps and method of producing electronic part'20046,624,504'Semiconductor device and method for manufacturing the same'20036,610,934'Semiconductor module and method of making the device'20036,595,404'Method of producing electronic part with bumps and method of producing electronic part'20036,515,372'Wiring board and its production method, semiconductor device and its production method, and electronic apparatus'20035,480,048'Multilayer wiring board fabricating method'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2015Patents assigned to HITACHI LTD (11)· patent assignee history
1996–2008Based in Fujisawa, JP· patent location history
2003–2019Based in Tokyo, JP· patent location history
2004–2008Patents assigned to RENESAS TECH CORP (12)· patent assignee history
2004–2015Based in Yokohama, JP· patent location history
2009Based in Kanagawa, JP· patent location history
2010Patents assigned to HITACHI VIA MECHANICS LTD (2)· patent assignee history
2015Patents assigned to YAMAGUCHI YOSHIHIDE (2)· patent assignee history
2015Patents assigned to HASEBE TAKEHIKO (1)· patent assignee history
2021Based in Iwata, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS TECH CORP | 12 | 2004–2008 |
| HITACHI LTD | 11 | 1996–2015 |
| HITACHI VIA MECHANICS LTD | 2 | 2010 |
| YAMAGUCHI YOSHIHIDEself | 2 | 2015 |
| HASEBE TAKEHIKO | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fujisawa, JP | 19 | 1996–2008 |
| Yokohama, JP | 6 | 2004–2015 |
| Tokyo, JP | 3 | 2003–2019 |
| Iwata, JP | 1 | 2021 |
| Kanagawa, JP | 1 | 2009 |