Inventor
Nobuyoshi Sato
Inventor
Zama, JP
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
B08BCleaning in general8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
C09DCoating compositions, e.g. paints, varnishes or lacquers6%
C23CCoating metallic material6%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
B41MPrinting, duplicating, marking, or copying processes4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
G01BMeasuring length, thickness or similar linear dimensions4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
PatentTitleYear
10,934,445Ink jet ink composition and image forming method202110,927,271Microcapsule, aqueous dispersion, method for manufacturing aqueous dispersion, and image forming method202110,919,017Aqueous dispersion, method for manufacturing the same, and image forming method202110,913,871Ink composition, method for producing the same, and image-forming method202110,914,379Dust cover202110,911,663Electronic apparatus and method for controlling the same202110,816,896Method for manufacturing imprinting template substrate, imprinting template substrate, imprinting template, and method for manufacturing semiconductor apparatus202010,359,697Imprinting template substrate, method for manufacturing the same, imprinting template substrate manufacturing apparatus, and method for manufacturing semiconductor apparatus201910,249,545Method for processing substrate including forming a film on a silicon-containing surface of the substrate to prevent resist from extruding from the substrate during an imprinting process20198,435,353'Thin film forming apparatus and method'20137,857,952'Method for treating the surface of object and apparatus thereof'20107,854,168'Thickness measuring device for vessel steel plate'20107,736,442'Method for activating surface of base material and apparatus thereof'20107,513,161'Device for measuring thickness of vessel steel plate'20097,371,659'Substrate laser marking'20087,323,096'Method for treating the surface of object and apparatus thereof'20087,300,527'Method for activating surface of base material and apparatus thereof'20077,143,011'System for diagnosing facility apparatus, managing apparatus and diagnostic apparatus'20067,139,681'System for diagnosing facility apparatus, managing apparatus and diagnostic apparatus'20067,085,684'System for diagnosing a facility apparatus'20066,830,775'Method of manufacturing superconducting quantum interference type magnetic fluxmeter'20046,691,576'Thickness measuring device for cylindrical tank bottom plate'20046,299,723'Anti-airlock apparatus for filters'20016,276,379'Anti-microbubble deposition apparatus'20016,248,180'Method for removing particles from a semiconductor wafer'20016,156,676'Laser marking of semiconductor wafer substrate while inhibiting adherence to substrate surface of particles generated during laser marking'20006,032,529'Liquid level sensor for buffered hydrofluoric acid'20005,605,867'Method of manufacturing insulating film of semiconductor device and apparatus for carrying out the same'19975,532,191'Method of chemical mechanical polishing planarization of an insulating film using an etching stop'19965,507,865'Aqueous ink'19965,336,640'Method of manufacturing a semiconductor device having an insulating layer composed of a BPSG film and a plasma-CVD silicon nitride film'19945,296,037'Plasma CVD system comprising plural upper electrodes'19945,290,736'Method of forming interlayer-insulating film using ozone and organic silanes at a pressure above atmospheric'19945,090,515'Passenger transport installation, vehicle for use therein, and method of operating said installation'19924,150,975'Process for producing metallic chromium'1979Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1997Patents assigned to KAWASAKI STEEL CO (5)· patent assignee history
1994–1997Based in Chiba, JP· patent location history
2000–2008Patents assigned to LSI LOGIC CORP (6)· patent assignee history
2000–2001Based in Tsukuba, JP· patent location history
2006–2010Patents assigned to ASAHI KASEI ENGINEERING CORP (4)· patent assignee history
2006–2010Based in Zama, JP· patent location history
2007–2013Patents assigned to SATO NOBUYOSHI (4)· patent assignee history
2013–2020Based in Mie, JP· patent location history
2021Patents assigned to FUJIFILM CORP (4)· patent assignee history
2021Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 6 | 2000–2008 |
| KAWASAKI STEEL CO | 5 | 1994–1997 |
| ASAHI KASEI ENGINEERING CORP | 4 | 2006–2010 |
| FUJIFILM CORP | 4 | 2021 |
| SATO NOBUYOSHIself | 4 | 2007–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zama, JP | 5 | 2006–2010 |
| Tsukuba, JP | 5 | 2000–2001 |
| Chiba, JP | 5 | 1994–1997 |
| Kanagawa, JP | 4 | 2021 |
| Mie, JP | 4 | 2013–2020 |