Inventor

Yi Heng Tsai

Inventor

Hsinchu, TW

Overview

24→

Patents

2012–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Cprimary

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems30%

B81BMicrostructural devices or systems, e.g. micromechanical devices27%

H01LSemiconductor devices8%

H10DInorganic electric semiconductor devices8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

Y10TTechnical subjects covered by former us classification6%

G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%

H02NElectric machines not otherwise provided for5%

PatentTitleYear

10,737,936Semiconductor structure and method for fabricating the same2020 10,541,627MEMS structure and method of forming same2020 10,087,071Semiconductor structure and manufacturing method thereof2018 9,975,754Semiconductor structure and manufacturing method thereof2018 9,859,819'MEMS structure and method of forming same'2018 9,656,855'Semiconductor structure and manufacturing method thereof'2017 9,502,370'Semiconductor bonding structure and process'2016 9,493,346'Capacitor with planarized bonding for CMOS-MEMS integration'2016 9,449,867'VHF etch barrier for semiconductor integrated microsystem'2016 9,446,945'Isolation structure for MEMS 3D IC integration'2016 9,422,153'Support structure for TSV in MEMS structure'2016 9,418,849'Cavity structure using patterned sacrificial layer'2016 9,281,287'Semiconductor bonding structure and process'2016 9,266,724'Method for handling a thin substrate and for substrate capping'2016 9,085,456'Support structure for TSV in MEMS structure'2015 9,065,358'MEMS structure and method of forming same'2015 8,878,312'Electrical bypass structure for MEMS device'2014 8,878,355'Semiconductor bonding structure and process'2014 8,796,110'Method for handling a thin substrate and for substrate capping'2014 8,704,317'Microstructure device with an improved anchor'2014 8,633,554'MEMS device etch stop'2014 8,368,152'MEMS device etch stop'2013 8,343,789'Microstructure device with an improved anchor'2013 8,232,614'Package systems having a conductive element through a substrate thereof and manufacturing methods of the same'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (12)· patent assignee history

2012–2015Patents assigned to TSAI YI HENG (7)· patent assignee history

2012–2015Patents assigned to CHANG KUEI-SUNG (6)· patent assignee history

2012–2015Patents assigned to CHU CHIA-HUA (4)· patent assignee history

2012–2020Based in Hsinchu, TW· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG	12	2012–2016
TAIWAN SEMICONDUCTOR MFG CO LTD	12	2016–2020
TSAI YI HENGself	7	2012–2015
CHANG KUEI-SUNG	6	2012–2015
CHU CHIA-HUA	4	2012–2015

Locations

Location	Patents	Span
Hsinchu, TW	24	2012–2020