Inventor
Kaori Takimoto
Inventor
Kanagawa, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation29%
H01LSemiconductor devices21%
H10KOrganic electric solid-state devices16%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%
H04NPictorial communication, e.g. television2%
PatentTitleYear
10,955,305Sensor chip junction structure and pressure sensor202110,840,303Solid state image sensor, production method thereof and electronic device202010,804,312Semiconductor device and electronic device having a chip size package (CSP)202010,403,669Semiconductor device and electronic device having a chip size package (CSP) stack201910,304,904Solid state image sensor, production method thereof and electronic device201910,014,349Solid state image sensor, production method thereof and electronic device20189,786,708'Unit pixel having an insulated contact penetrating a charge accumulation region, solid-state image pickup unit including the same, and method of manufacturing the unit pixel'20179,666,643'Solid state image sensor, production method thereof and electronic device'20179,490,441'Semiconductor device, method of manufacturing semiconductor device, solid-state image pickup unit, and electronic apparatus'20169,412,791'Solid state imaging element, production method thereof and electronic device'20169,281,486'Semiconductor device, method of manufacturing semiconductor device, solid-state imaging unit, and electronic apparatus'20169,219,100'Semiconductor device and solid-state image pickup unit'20158,912,579'Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus'20148,760,545'Solid-state imaging device, manufacturing method therefor, solid-state imaging apparatus, and image capturing apparatus'20148,384,166'Method for manufacturing semiconductor device and semiconductor device'20138,247,847'Solid-state imaging device and manufacturing method therefor'20127,977,140'Methods for producing solid-state imaging device and electronic device'20117,939,860'Solid-state imaging device'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2020Patents assigned to SONY CORP (14)· patent assignee history
2011–2020Based in Kanagawa, JP· patent location history
2012–2014Patents assigned to TAKIMOTO KAORI (4)· patent assignee history
2012Patents assigned to OKADA MASAYUKI (1)· patent assignee history
2017–2020Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (4)· patent assignee history
2021Patents assigned to SAGINOMIYA SEISAKUSHO INC (1)· patent assignee history
2021Based in Sayama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 14 | 2011–2020 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 4 | 2017–2020 |
| TAKIMOTO KAORIself | 4 | 2012–2014 |
| OKADA MASAYUKI | 1 | 2012 |
| SAGINOMIYA SEISAKUSHO INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 17 | 2011–2020 |
| Sayama, JP | 1 | 2021 |