Inventor
Kuang-Ho Liao
Inventor
Taipei, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
6,844,616'Multi-chip semiconductor package structure'20056,458,617'Multi-chip semiconductor package structure'20026,245,598'Method for wire bonding a chip to a substrate with recessed bond pads and devices formed'20016,220,102'Die-shear test fixture apparatus'20016,122,822'Method for balancing mold flow in encapsulating devices'20006,075,281'Modified lead finger for wire bonding'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2005Patents assigned to VANGUARD INT SEMICONDUCT CORP (6)· patent assignee history
2000–2005Based in Taipei, TW· patent location history
2000Based in Yun Lin Hsien, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VANGUARD INT SEMICONDUCT CORP | 6 | 2000–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 5 | 2000–2005 |
| Yun Lin Hsien, TW | 1 | 2000 |