Inventor

Yu-Peng Tsai

Inventor

Taipei, TW

Overview

29→

Patents

2013–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%

H01LSemiconductor devices35%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling3%

H05KPrinted circuits3%

B23KSoldering or unsoldering1%

H01QAntennas, i.e. radio aerials1%

H10DInorganic electric semiconductor devices1%

Y10TTechnical subjects covered by former us classification1%

PatentTitleYear

10,868,353Electronic device and manufacturing method thereof2020 10,790,261Bonding through multi-shot laser reflow2020 10,784,221Method of processing solder bump by vacuum annealing2020 10,622,240Package on-package structure2020 10,535,644Manufacturing method of package on package structure2020 10,134,703Package on-package process for applying molding compound2018 9,859,229'Package structure and method for forming the same'2018 9,786,622'Semiconductor package'2017 9,768,048'Package on-package structure'2017 9,754,908'Wafer with liquid molding compound and post-passivation interconnect'2017 9,698,028'Semiconductor package and method of manufacturing the same'2017 9,679,790'Singulation apparatus and method'2017 9,627,369'Packages and methods for forming the same'2017 9,559,005'Methods of packaging and dicing semiconductor devices and structures thereof'2017 9,431,360'Semiconductor structure and manufacturing method thereof'2016 9,385,040'Method of manufacturing a semiconductor device'2016 9,331,023'Device packaging'2016 9,269,687'Packaging methods and packaged semiconductor devices'2016 9,257,321'Singulation apparatus and method'2016 9,196,559'Directly sawing wafers covered with liquid molding compound'2015 9,082,776'Semiconductor package having protective layer with curved surface and method of manufacturing same'2015 9,082,636'Packaging methods and structures for semiconductor devices'2015 9,073,158'Methods for forming 3DIC package'2015 9,030,022'Packages and methods for forming the same'2015 8,987,058'Method for wafer separation'2015 8,927,391'Package-on-package process for applying molding compound'2015 8,884,431'Packaging methods and structures for semiconductor devices'2014 8,853,002'Methods for metal bump die assembly'2014 8,609,462'Methods for forming 3DIC package'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (14)· patent assignee history

2013–2017Patents assigned to CHENG MING-DA (6)· patent assignee history

2013–2017Patents assigned to LIU CHUNG-SHI (6)· patent assignee history

2013–2017Patents assigned to TSAI YU-PENG (6)· patent assignee history

2013–2020Based in Taipei, TW· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (15)· patent assignee history

2017–2020Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	15	2016–2020
TAIWAN SEMICONDUCTOR MFG	14	2013–2016
CHENG MING-DA	6	2013–2017
LIU CHUNG-SHI	6	2013–2017
TSAI YU-PENGself	6	2013–2017

Locations

Location	Patents	Span
Taipei, TW	27	2013–2020
Hsinchu, TW	2	2017–2020