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Inventor

SangDo Lee

Inventor
Jiangsu, CN

Overview

2→
Patents
2009–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,084,870'Semiconductor devices and electrical parts manufacturing using metal coated wires'20117,564,124'Semiconductor die package including stacked dice and heat sink structures'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2011Patents assigned to FAIRCHILD SEMICONDUCTOR (2)· patent assignee history
2009–2011Based in Jiangsu, CN· patent location history
2011Patents assigned to CAI BIN (1)· patent assignee history
2011Patents assigned to KWON YONKSUK (1)· patent assignee history
2011Patents assigned to LEE SANGDO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FAIRCHILD SEMICONDUCTOR22009–2011
CAI BIN12011
KWON YONKSUK12011
LEE SANGDOself12011
Locations
LocationPatentsSpan
Jiangsu, CN22009–2011