Inventor
Sung-Feng Yeh
Inventor
Taipei, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
A63BApparatus for physical training, gymnastics, swimming, climbing, or fencing15%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
11,004,8263DIC formation with dies bonded to formed RDLs202110,971,443Packages with Si-substrate-free interposer and method forming same202110,886,245Semiconductor structure, 3DIC structure and method of fabricating the same20219,452,315'Treadmill'20168,025,455'Fixing device for an extension tube of an exercise device'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to CHANG TSUNG CHI (1)· patent assignee history
2011Patents assigned to HUANG HSUAN FU (1)· patent assignee history
2011Patents assigned to YEH SHANG-WEI (1)· patent assignee history
2011–2021Based in Taipei, TW· patent location history
2016Patents assigned to DYACO INT INC (1)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2021 |
| CHANG TSUNG CHI | 1 | 2011 |
| DYACO INT INC | 1 | 2016 |
| HUANG HSUAN FU | 1 | 2011 |
| YEH SHANG-WEIself | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 5 | 2011–2021 |