Inventor
TA-WEI CHIU
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices24%
H01JElectric discharge tubes or discharge lamps10%
H10BElectronic memory devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,538,768Semiconductor structure and fabrication method thereof202612,342,585Semiconductor structure and fabrication method thereof202512,310,071Semiconductor structure and fabrication method thereof202512,183,809Manufacturing method of semiconductor device202412,100,624Semiconductor device and method of fabricating the same202411,984,294Emitter, electron gun in which same is used, electronic device in which same is used, and method for manufacturing same202411,915,920Emitter, electron gun in which same is used, electronic device in which same is used, and method for manufacturing same202411,515,404Semiconductor structure comprising regions having an isolation trench with a stepped bottom surface therebetween and method of forming the same202211,404,305Manufacturing method of isolation structures for semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to UNITED MICROELECTRONICS CORP (7)· patent assignee history
2022–2026Based in TW· patent location history
2024Patents assigned to NAT INST MATERIALS SCIENCE (2)· patent assignee history
2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 7 | 2022–2026 |
| NAT INST MATERIALS SCIENCE | 2 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2026 |
| JP | 2 | 2024 |