Inventor
Katsuaki Kojima
Inventor
Nagoya, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits30%
Y10TTechnical subjects covered by former us classification30%
C23CCoating metallic material20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
C09JAdhesives10%
PatentTitleYear
6,784,375'Interconnection structure for interconnecting printed circuit boards'20046,605,357'Bonding method and bonding structure of thermoplastic resin material'20036,449,836'Method for interconnecting printed circuit boards and interconnection structure'20025,965,211'Electroless copper plating solution and process for formation of copper film'19995,039,338'Electroless copper plating solution and process for formation of copper film'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–1999Patents assigned to NIPPON DENSO CO (2)· patent assignee history
1991–2004Based in Nagoya, JP· patent location history
2002–2004Patents assigned to DENSO CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENSO CORP | 3 | 2002–2004 |
| NIPPON DENSO CO | 2 | 1991–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagoya, JP | 5 | 1991–2004 |