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Inventor

Mie Matsuo

Inventor
Kamakura, JP

Overview

48→
Patents
1995–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10DInorganic electric semiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
G02BOptical elements, systems or apparatus4%
H04NPictorial communication, e.g. television3%
H10BElectronic memory devices3%
B82YSpecific uses or applications of nanostructures3%
H01LSemiconductor devices3%
H03HImpedance networks, e.g. resonant circuits3%
PatentTitleYear
11,101,167Semiconductor device manufacturing method and semiconductor device202110,892,269Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuit20219,633,902'Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching'20178,837,871'Optical waveguide sensor chip, optical waveguide sensor, and method for manufacturing optical waveguide sensor chip'20148,748,316'Method of manufacturing semiconductor device, semiconductor device, and camera module'20148,580,652'Semiconductor device and manufacturing method thereof'20138,283,755'Multichip semiconductor device, chip therefor and method of formation thereof'20128,257,504'Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device'20128,237,285'Semiconductor device, through hole having expansion portion and thin insulating film'20128,228,426'Semiconductor package and camera module'20128,179,730'Semiconductor device and semiconductor memory tester'20128,174,093'Multichip semiconductor device, chip therefor and method of formation thereof'20128,098,312'Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit'20127,869,240'Semiconductor device and semiconductor memory tester'20117,859,073'Back-illuminated type solid-state image pickup device and camera module using the same'20107,829,975'Multichip semiconductor device, chip therefor and method of formation thereof'20107,808,064'Semiconductor package including through-hole electrode and light-transmitting substrate'20107,608,537'Method for fabricating semiconductor device'20097,531,876'Semiconductor device having power semiconductor elements'20097,521,352'Method for manufacturing a semiconductor device'20097,507,634'Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment'20097,482,194'Electronic component having micro-electrical mechanical system'20097,427,797'Semiconductor device having actuator'20087,402,903'Semiconductor device'20087,335,517'Multichip semiconductor device, chip therefor and method of formation thereof'20087,238,919'Heating element movement bonding method for semiconductor components'20077,235,456'Method of making empty space in silicon'20077,177,134'Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device'20077,095,112'Semiconductor device, semiconductor package member, and semiconductor device manufacturing method'20067,067,897'Semiconductor device'20067,053,456'Electronic component having micro-electrical mechanical system'20067,019,364'Semiconductor substrate having pillars within a closed empty space'20067,019,398'Semiconductor device'20066,991,964'Stacked type semiconductor device'20066,933,205'Integrated circuit device and method of manufacturing the same'20056,812,557'Stacked type semiconductor device'20046,809,421'Multichip semiconductor device, chip therefor and method of formation thereof'20046,791,175'Stacked type semiconductor device'20046,734,568'Semiconductor device and method of manufacturing the same'20046,717,251'Stacked type semiconductor device'20046,709,966'Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device'20046,614,106'Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device'20036,504,227'Passive semiconductor device mounted as daughter chip on active semiconductor device'20035,775,980'Polishing method and polishing apparatus'19985,731,634'Semiconductor device having a metal film formed in a groove in an insulating film'19985,607,718'Polishing method and polishing apparatus'19975,561,082'Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide'19965,424,246'Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2017Patents assigned to TOSHIBA KK (46)· patent assignee history
1995–1998Based in Yokohama, JP· patent location history
2003–2017Based in Kamakura, JP· patent location history
2007–2014Based in Kanagawa, JP· patent location history
2012–2014Patents assigned to MATSUO MIE (10)· patent assignee history
2012–2013Patents assigned to SEKIGUCHI MASAHIRO (3)· patent assignee history
2012–2014Patents assigned to TANIDA KAZUMASA (3)· patent assignee history
2012Patents assigned to HAYASAKA NOBUO (2)· patent assignee history
2012Based in Minato-ku, JP· patent location history
2021Based in Yokkaichi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK461995–2017
MATSUO MIEself102012–2014
SEKIGUCHI MASAHIRO32012–2013
TANIDA KAZUMASA32012–2014
HAYASAKA NOBUO22012
Locations
LocationPatentsSpan
Kamakura, JP342003–2017
Kanagawa, JP62007–2014
Yokohama, JP51995–1998
Yokkaichi, JP22021
Minato-ku, JP12012