Inventor
Tetsuya Enomoto
Inventor
Ibaraki, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
C08LCompositions of macromolecular compounds10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
H01LSemiconductor devices7%
H04NPictorial communication, e.g. television7%
C09JAdhesives6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
11,048,167Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component202110,725,379Polymide precursor resin composition20209,751,984'Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition'20179,431,314'Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device'20169,129,898'Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device'20159,123,734'Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device'20159,024,455'Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device'20158,674,502'Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device'20148,034,659'Production method of semiconductor device and bonding film'20118,028,402'Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof'20117,907,232'Liquid crystal display device'20117,704,799'Method of manufacturing wiring substrate'20107,488,521'Resinous tube'20097,439,991'Image information presentation system, image information presentation method, medium storing image information presentation system program, and signal therefor'20087,205,645'Wiring board, semiconductor device, and method of manufacturing wiring board'20076,747,610'Stereoscopic image display apparatus capable of selectively displaying desired stereoscopic image'20046,553,184'Method of converting two dimensional images into three-dimensional images'20036,336,210'Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation device'20026,133,683'Color cathode ray tube having an internal voltage divider'20005,825,997'Apparatus for producing a three dimensional image from a two dimensional image'19985,739,844'Method of converting two-dimensional image into three-dimensional image'19984,894,531'Photodetector for receiving an index signal of a beam-index cathode-ray tube'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2008Patents assigned to SANYO ELECTRIC CO (7)· patent assignee history
1990–2003Based in Hirakata, JP· patent location history
2002–2008Based in Yawata, JP· patent location history
2007–2016Patents assigned to HITACHI CHEMICAL CO LTD (9)· patent assignee history
2007–2020Based in Ibaraki, JP· patent location history
2011–2016Based in Tsukuba, JP· patent location history
2014–2016Patents assigned to ENOMOTO TETSUYA (3)· patent assignee history
2014–2016Patents assigned to HONDA KAZUTAKA (3)· patent assignee history
2017–2021Patents assigned to HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (3)· patent assignee history
2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 9 | 2007–2016 |
| SANYO ELECTRIC CO | 7 | 1990–2008 |
| ENOMOTO TETSUYAself | 3 | 2014–2016 |
| HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD | 3 | 2017–2021 |
| HONDA KAZUTAKA | 3 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 7 | 2007–2020 |
| Tsukuba, JP | 4 | 2011–2016 |
| Yawata, JP | 3 | 2002–2008 |
| Hirakata, JP | 3 | 1990–2003 |
| Tokyo, JP | 1 | 2021 |