Inventor
Chih-Hua Chen
Inventor
Zhubei City, TW
Overview
Patents· 89 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
G06KGraphical data reading6%
G06VImage or video recognition or understanding5%
H10DInorganic electric semiconductor devices2%
G06FElectric digital data processing2%
H03KPulse technique2%
Y04SSystems integrating technologies related to power network operation, communication or information technologies for improving the electrical power generation, transmission, distribution, management or usage, i.e. smart grids2%
F04DNon-positive-displacement pumps1%
PatentTitleYear
11,016,270Photographing optical lens assembly, imaging apparatus and electronic device202110,878,073Fingerprint sensor pixel array and methods of forming same202010,879,228Packaging mechanisms for dies with different sizes of connectors202010,879,221Package-on-package structure202010,853,616Fingerprint sensor device and method202010,811,384Semiconductor package and method of manufacturing the same202010,762,319Fingerprint sensor and manufacturing method thereof202010,720,416Semiconductor package including thermal relaxation block and manufacturing method thereof202010,707,094Semiconductor package and manufacturing process thereof202010,698,994Fingerprint sensor pixel array and methods of forming same202010,672,729Package structure and method of forming package structure202010,658,334Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die202010,629,580Packaging mechanisms for dies with different sizes of connectors202010,610,720Mouth-opening training device having water-filled bag202010,509,938Fingerprint sensor device and method201910,510,713Semicondcutor package and method of manufacturing the same201910,510,631Fan out package structure and method of manufacturing the same201910,510,644Package structures and methods for forming the same201910,361,181Packaging mechanisms for dies with different sizes of connectors201910,354,931Packaging mechanisms for dies with different sizes of connectors201910,354,114Fingerprint sensor in InFO structure and formation method201910,276,402Semiconductor package and manufacturing process thereof201910,268,872Fingerprint sensor device and method201910,268,868Fingerprint sensor device and method201910,157,274Fingerprint sensor pixel array and methods of forming same201810,157,808Package structure and method of forming package structure201810,157,829Method for forming a passive device on a package-on-package structure201810,074,615Package structure and method of fabricating the same201810,026,551Magnetic capacitor structures201810,006,864Carrier concentration measuring method and apparatus thereof20189,943,239Optical sensing system and associated electronic device20189,911,725'Packaging mechanisms for dies with different sizes of connectors'20189,911,724'Multi-chip package system and methods of forming the same'20189,904,776'Fingerprint sensor pixel array and methods of forming same'20189,898,645'Fingerprint sensor device and method'20189,881,885'Metal routing architecture for integrated circuits'20189,881,850'Package structures and method of forming the same'20189,875,388Fingerprint sensor device and method20189,761,503'Packaging mechanisms for dies with different sizes of connectors'20179,748,216'Apparatus and method for a component package'20179,691,708'Semiconductor package and manufacturing method thereof'20179,679,836'Package structures and methods for forming the same'20179,646,894'Packaging mechanisms for dies with different sizes of connectors'20179,589,941'Multi-chip package system and methods of forming the same'20179,490,167'Pop structures and methods of forming the same'20169,478,474'Methods and apparatus for forming package-on-packages'20169,343,442'Passive devices in package-on-package structures and methods for forming the same'20169,312,230'Conductive pillar structure for semiconductor substrate and method of manufacture'20169,293,449'Methods and apparatus for package on package devices with reversed stud bump through via interconnections'20169,257,332'Through-assembly via modules and methods for forming the same'20169,258,922'PoP structures including through-assembly via modules'20169,224,688'Metal routing architecture for integrated circuits'20159,173,019'Loudspeaker with rotatable sound-reflecting member'20159,070,644'Packaging mechanisms for dies with different sizes of connectors'20159,040,350'Packaging and function tests for package-on-package and system-in-package structures'20159,031,263'Loudspeaker'20158,975,726'POP structures and methods of forming the same'20158,967,963'Fan module'20158,928,114'Through-assembly via modules and methods for forming the same'20158,922,005'Methods and apparatus for package on package devices with reversed stud bump through via interconnections'20148,916,971'Multi-direction design for bump pad structures'20148,889,484'Apparatus and method for a component package'20148,765,497'Packaging and function tests for package-on-package and system-in-package structures'20148,753,971'Dummy metal design for packaging structures'20148,737,063'Fastening device for hard disk drive'20148,729,700'Multi-direction design for bump pad structures'20148,703,609'Through-substrate via for semiconductor device'20148,653,648'Zigzag pattern for TSV copper adhesion'20148,624,376'Package-on-package structure without through assembly vias'20148,613,588'Fan module and vibration-damping mounting therefor'20138,598,715'Bump-on-trace structures in packaging'20138,546,941'Multi-direction design for bump pad structures'20138,476,769'Through-silicon vias and methods for forming the same'20138,431,421'Test patterns for detecting misalignment of through-wafer vias'20138,322,974'Fan module with vibration-resistent mounting'20128,315,054'Rack server center'20128,259,965'Loudspeaker device with sound enhancing structure'20128,202,800'Method of forming through silicon via with dummy structure'20128,193,639'Dummy metal design for packaging structures'20128,178,970'Strong interconnection post geometry'20128,049,327'Through-silicon via with scalloped sidewalls'20117,973,413'Through-substrate via for semiconductor device'20117,969,013'Through silicon via with dummy structure and method for forming the same'20117,816,227'Tapered through-silicon via structure'20107,785,927'Multi-die wafer level packaging'20107,564,115'Tapered through-silicon via structure'20097,557,423'Semiconductor structure with a discontinuous material density for reducing eddy currents'20097,528,492'Test patterns for detecting misalignment of through-wafer vias'20097,514,797'Multi-die wafer level packaging'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (35)· patent assignee history
2009–2018Based in Taipei, TW· patent location history
2011–2017Based in Jhubei City, TW· patent location history
2012–2017Patents assigned to CHEN CHIH-HUA (22)· patent assignee history
2012–2017Patents assigned to CHEN CHEN-SHIEN (13)· patent assignee history
2012–2017Patents assigned to KUO CHEN-CHENG (11)· patent assignee history
2014–2020Based in Zhubei City, TW· patent location history
2014–2015Based in New Taipei, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (42)· patent assignee history
2017–2020Based in Hsinchu County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 42 | 2016–2020 |
| TAIWAN SEMICONDUCTOR MFG | 35 | 2009–2016 |
| CHEN CHIH-HUAself | 22 | 2012–2017 |
| CHEN CHEN-SHIEN | 13 | 2012–2017 |
| KUO CHEN-CHENG | 11 | 2012–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zhubei City, TW | 31 | 2014–2020 |
| Jhubei City, TW | 21 | 2011–2017 |
| Taipei, TW | 15 | 2009–2018 |
| Hsinchu County, TW | 12 | 2017–2020 |
| New Taipei, TW | 4 | 2014–2015 |