Inventor
ALEXANDER DZHANGIROV
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
G01BMeasuring length, thickness or similar linear dimensions8%
H05KPrinted circuits8%
PatentTitleYear
12,557,682Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereof202612,431,458Bonding device and adjustment method for bonding head202512,191,276Mounting apparatus202512,018,936Mounting apparatus and parallelism detection method in mounting apparatus2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to SHINKAWA KK (3)· patent assignee history
2024–2026Based in JP· patent location history
2026Patents assigned to YAMAHA ROBOTICS CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKAWA KK | 3 | 2024–2025 |
| YAMAHA ROBOTICS CO LTD | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2024–2026 |