Inventor
YEOW CHON ONG
Inventor
SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
C09JAdhesives8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
12,506,134—202512,438,113Conductive adhesive assembly for semiconductor die attachment202512,368,113Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices202512,362,247Semiconductor devices with flexible spacer including a support structure and methods of making the same202512,080,616Reinforced semiconductor device packaging and associated systems and methods2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2024–2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 5 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 5 | 2024–2025 |