Inventor
BAI NIE
Inventor
US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
G02BOptical elements, systems or apparatus15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10DInorganic electric semiconductor devices2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
12,568,831Patternable die attach materials and processes for patterning202612,560,771Die first fan-out architecture for electric and optical integration202612,546,957Photonic integrated circuit packaging architectures202612,543,578Electronic packaging architecture with customized variable metal thickness on same buildup layer202612,517,314High bandwidth optical interconnection architectures202612,504,581Photonic interconnect and components in glass202512,422,615Nested glass packaging architecture for hybrid electrical and optical communication devices202512,394,719Methods and apparatus to increase glass core thickness202512,354,963Lithographic cavity formation to enable EMIB bump pitch scaling202512,354,883Omni directional interconnect with magnetic fillers in mold matrix202512,345,932Die last and waveguide last architecture for silicon photonic packaging202512,334,443Lithographic cavity formation to enable EMIB bump pitch scaling202511,929,330Lithographic cavity formation to enable EMIB bump pitch scaling202411,923,307Microelectronic structures including bridges202411,923,312Patternable die attach materials and processes for patterning202411,837,534Substrate with variable height conductive and dielectric elements202311,694,898Hybrid fine line spacing architecture for bump pitch scaling202311,521,931Microelectronic structures including bridges202211,322,444Lithographic cavity formation to enable EMIB bump pitch scaling2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (19)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 19 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 19 | 2022–2026 |