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Inventor

Jie Deng

Inventor
South Burlington, VT, US

Overview

4→
Patents
2018–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10DInorganic electric semiconductor devices30%
B82YSpecific uses or applications of nanostructures10%
G06FElectric digital data processing10%
H03KPulse technique10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
11,011,633Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction202110,943,977GAA FET with U-shaped channel202110,892,322Circuits employing a double diffusion break (DDB) and single diffusion break (SDB) in different type diffusion region(s), and related fabrication methods202110,031,764Managing executable files2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to IBM (1)· patent assignee history
2018Patents assigned to INT BUSINESS MACHINES CORORATION (1)· patent assignee history
2018Based in Beijing, CN· patent location history
2021Patents assigned to PSEMI CORP (1)· patent assignee history
2021Patents assigned to QUALCOMM INC (1)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2021Based in South Burlington, VT, US· patent location history
2021Based in New Taipei, TW· patent location history
2021Based in San Diego, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM12018
INT BUSINESS MACHINES CORORATION12018
PSEMI CORP12021
QUALCOMM INC12021
TAIWAN SEMICONDUCTOR MFG CO LTD12021
Locations
LocationPatentsSpan
South Burlington, VT, US12021
New Taipei, TW12021
San Diego, California, US12021
Beijing, CN12018