Inventor
Cheng-Hsien Hsieh
Inventor
Kaohsiung, TW
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B23KSoldering or unsoldering3%
H10BElectronic memory devices2%
LOC242%
B82YSpecific uses or applications of nanostructures1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
H05KPrinted circuits1%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
10,867,900Dummy metal with zigzagged edges202010,833,030Semiconductor device and method of manufacture202010,818,800Semiconductor structure and method for preparing the same202010,763,212Semiconductor structure202010,714,426Semiconductor package and method of forming the same202010,700,045Surface mount device/integrated passive device on package or device structure and methods of forming202010,665,4743D packages and methods for forming the same202010,629,537Conductive vias in semiconductor packages and methods of forming same202010,510,654Dummy metal with zigzagged edges201910,504,877Surface mount device/integrated passive device on package or device structure and methods of forming201910,504,751Package structures and method of forming the same201910,475,768Redistribution layers in semiconductor packages and methods of forming same201910,416,566Optimization of source and bandwidth for new and existing patterning devices201910,319,681Dummy features in redistribution layers (RDLS) and methods of forming same201910,290,584Conductive vias in semiconductor packages and methods of forming same201910,276,532Three-dimensional chip stack and method of forming the same201910,269,5843D packages and methods for forming the same201910,269,738Semiconductor device and method of manufacture201910,163,805Package structure and method for forming the same201810,165,682Opening in the pad for bonding integrated passive device in InFO package201810,157,825Dummy metal with zigzagged edges201810,141,288Surface mount device/integrated passive device on package or device structure and methods of forming201810,109,607Under bump metallurgy (UBM) and methods of forming same201810,062,648Semiconductor package and method of forming the same201810,032,651Package structures and method of forming the same20189,997,464Dummy features in redistribution layers (RDLS) and methods of forming same20189,929,112'Semiconductor device and method of manufacture'20189,812,426'Integrated fan-out package, semiconductor device, and method of fabricating the same'20179,793,231'Under bump metallurgy (UBM) and methods of forming same'20179,741,690'Redistribution layers in semiconductor packages and methods of forming same'20179,698,115'Three-dimensional chip stack and method of forming the same'20179,640,496'Semiconductor device'20179,627,288'Package structures and methods of forming the same'20179,502,343'Dummy metal with zigzagged edges'20169,355,980'Three-dimensional chip stack and method of forming the same'20169,299,649'3D packages and methods for forming the same'2016D0577440'Blood pressure monitor'2008D0562457'Blood pressure monitor'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008Patents assigned to FKA DISTRIBUTING CO (2)· patent assignee history
2008Based in Jhonghe, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (31)· patent assignee history
2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2016–2020Based in Kaohsiung, TW· patent location history
2016–2018Based in Hsinchu, TW· patent location history
2019Patents assigned to ASML NETHERLANDS BV (1)· patent assignee history
2019Based in Taipei, TW· patent location history
2020Patents assigned to NANYA TECHNOLOGY CORP (2)· patent assignee history
2020Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 31 | 2016–2020 |
| FKA DISTRIBUTING CO | 2 | 2008 |
| NANYA TECHNOLOGY CORP | 2 | 2020 |
| TAIWAN SEMICONDUCTOR MFG | 2 | 2016 |
| ASML NETHERLANDS BV | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 31 | 2016–2020 |
| New Taipei, TW | 2 | 2020 |
| Hsinchu, TW | 2 | 2016–2018 |
| Jhonghe, TW | 2 | 2008 |
| Taipei, TW | 1 | 2019 |