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Inventor

XI LIN LI

Inventor
CN

Overview

2→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,283,559Copper wire bond on gold bump on semiconductor die bond pad202511,515,275Copper wire bond on gold bump on semiconductor die bond pad2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TEXAS INSTRUMENTS INC (2)· patent assignee history
2022–2025Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC22022–2025
Locations
LocationPatentsSpan
CN22022–2025