Inventor

Junichi Saeki

Inventor

Yokohama, JP

Overview

1984–2012

Patent span

Electricity

Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

H05KPrinted circuits21%

H10DInorganic electric semiconductor devices20%

B29CShaping or joining of plastics9%

Y10TTechnical subjects covered by former us classification8%

G06FElectric digital data processing4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts1%

G01NInvestigating or analysing materials by determining their chemical or physical properties1%

G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes1%

PatentTitleYear

8,095,348'Support system, support method and support program of resin molded article'2012 7,277,771'Three-dimensional foam analysis method, product design aiding method using the analysis method, and recording medium recording these methods'2007 7,096,083'Design support apparatus and method for supporting design of resin mold product'2006 7,023,027'Diode package having an anode and a cathode formed on one surface of a diode chip'2006 6,919,622'Semiconductor device'2005 6,861,294'Semiconductor devices and methods of making the devices'2005 6,844,219'Semiconductor device and lead frame therefor'2005 6,720,208'Semiconductor device'2004 6,686,226'Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame'2004 6,531,760'Semiconductor device'2003 6,465,876'Semiconductor device and lead frame therefor'2002 6,326,681'Semiconductor device'2001 6,303,982'Semiconductor device'2001 6,291,880'Semiconductor device including an integrally molded lead frame'2001 6,204,552'Semiconductor device'2001 6,130,114'Semiconductor device'2000 6,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'2000 6,114,192'Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame'2000 6,100,580'Semiconductor device having all outer leads extending from one side of a resin member'2000 6,100,115'Semiconductor device'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,069,029'Semiconductor device chip on lead and lead on chip manufacturing'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,530'Semiconductor device'1999 5,914,531'Semiconductor device having a ball grid array package structure using a supporting frame'1999 5,863,817'Semiconductor device'1999 5,821,606'Semiconductor device'1998 5,811,877'Semiconductor device structure'1998 5,793,099'Semiconductor device'1998 5,612,569'Semiconductor device'1997 5,572,430'Method and apparatus for cooperated design'1996 5,530,286'Semiconductor device'1996 5,371,044'Method of uniformly encapsulating a semiconductor device in resin'1994 5,358,904'Semiconductor device'1994 5,287,284'Product specification complex analysis system'1994 5,200,366'Semiconductor device, its fabrication method and molding apparatus used therefor'1993 5,125,821'Resin flow and curing measuring device'1992 5,068,712'Semiconductor device'1991 4,989,166'Method for synthesizing analysis model and flow analysis system'1991 4,983,110'Resin encapsulating apparatus for semiconductor devices'1991 4,954,301'Transfer molding process and an apparatus for the same'1990 4,946,633'Method of producing semiconductor devices'1990 4,900,501'Method and apparatus for encapsulating semi-conductors'1990 4,426,341'Transfer molding method and transfer molding machine'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984–2012Patents assigned to HITACHI LTD (39)· patent assignee history

1984–2012Based in Yokohama, JP· patent location history

2003Based in Yokohama-shi, Kanagawa, JP· patent location history

2004–2006Patents assigned to RENESAS TECH CORP (6)· patent assignee history

2012Patents assigned to KONO TSUTOMU (1)· patent assignee history

2012Patents assigned to SAEKI JUNICHI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	39	1984–2012
RENESAS TECH CORP	6	2004–2006
KONO TSUTOMU	1	2012
SAEKI JUNICHIself	1	2012

Locations

Location	Patents	Span
Yokohama, JP	45	1984–2012
Yokohama-shi, Kanagawa, JP	1	2003