Inventor
Nael Zohni
Inventor
San Jose, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H01LSemiconductor devices22%
H01GCapacitors11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
PatentTitleYear
10,840,192Stacked silicon package assembly having enhanced stiffener202010,043,730Stacked silicon package assembly having an enhanced lid20188,810,028'Integrated circuit packaging devices and methods'20148,228,682'Electronic assembly with trenches for underfill material'20126,540,467'Apparatus and method of semiconductor wafer protection'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to LSI LOGIC CORP (1)· patent assignee history
2003Based in Newark, CA, US· patent location history
2012–2020Patents assigned to XILINX INC (4)· patent assignee history
2012–2014Patents assigned to ZOHNI NAEL (2)· patent assignee history
2012–2014Based in Campbell, CA, US· patent location history
2014Patents assigned to BOJA RONILO (1)· patent assignee history
2014Patents assigned to NAGARAJAN KUMAR (1)· patent assignee history
2018–2020Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| XILINX INC | 4 | 2012–2020 |
| ZOHNI NAELself | 2 | 2012–2014 |
| BOJA RONILO | 1 | 2014 |
| LSI LOGIC CORP | 1 | 2003 |
| NAGARAJAN KUMAR | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 2 | 2018–2020 |
| Campbell, California, US | 2 | 2012–2014 |
| Newark, California, US | 1 | 2003 |