LexDanaLexDanabeta
Inventor

SHIH-SIAN HUANG

Inventor
TW

Overview

2→
Patents
2023–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing100%
PatentTitleYear
12,070,833Method of using polishing pad202411,691,243Method of using polishing pad2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2023–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22023–2024
Locations
LocationPatentsSpan
TW22023–2024