Inventor

Jung-Sik Choi

Inventor
Seongnam-si, KR

Overview

51→
Patents
1994–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C23CCoating metallic material10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H01LSemiconductor devices7%
H10DInorganic electric semiconductor devices7%
H10BElectronic memory devices5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
Y10TTechnical subjects covered by former us classification4%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
PatentTitleYear
10,719,263Method of handling page fault in nonvolatile main memory system202010,345,171Torque angle sensor module201910,230,367Electronic device and method of determining touch in electronic device201910,185,654Memory mapping management method for nonvolatile main memory system201910,049,882Method for fabricating semiconductor device including forming a dielectric layer on a structure having a height difference using ALD201810,037,099Method of operating touch module and electronic device supporting same201810,001,866Method of operating touch module and electronic device supporting same20189,899,231'Hard mask composition for spin-coating'20189,840,785'Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution'20179,812,329'Method of fabricating a semiconductor device'20179,627,205'Method of manufacturing a semiconductor device using purified block copolymers and semiconductor devices'20179,577,317'Heat radiation antenna device, portable terminal and battery cover therewith, and method for manufacturing the battery cover'20179,562,299'Copper electroplating solution and copper electroplating apparatus'20179,501,424'Memory mapping method of nonvolatile memory system and system for providing the memory mapping method'20169,472,345'Aluminum precursor, method of forming a thin film and method of forming a capacitor using the same'20169,458,365'Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same'20169,437,452'Method of forming a fine pattern by using block copolymers'20169,425,059'Methods of forming a pattern and methods of manufacturing a semiconductor device using the same'20169,359,382'β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same'20169,359,383'β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same'20169,343,326'CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same'20169,076,701'Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure'20158,795,505'Copper electroplating method'20148,715,895'Photosensitive resin composition for color filter and color filter using the same'20148,419,978'Anisotropic conductive film composition'20138,318,053'Photosensitive resin composition and color filter using the same'20128,273,270'Photosensitive resin composition and light blocking layer using the same'20128,268,397'Organometallic precursor, thin film having the same, metal wiring including the thin film, method of forming a thin film and method of manufacturing a metal wiring using the same'20128,138,057'Metal oxide alloy layer, method of forming the metal oxide alloy layer, and methods of manufacturing a gate structure and a capacitor including the metal oxide alloy layer'20128,036,103'Portable internet radio access station including multiple management processors and method of controlling the multiple management processors'20117,879,259'Anisotropic conductive film composition'20117,851,789'Photosensitive resin composition for pad protective layer, and method for making image sensor using the same'20107,700,007'Anisotropic conductive film forming composition'20107,662,448'Photosensitive resin composition for column spacers for liquid crystal display device, column spacers formed using the composition and display device comprising the column spacers'20107,648,854'Methods of forming metal oxide layers, methods of forming gate structures using the same, and methods of forming capacitors using the same'20107,642,200'Methods of forming a thin film and methods of manufacturing a capacitor and a gate structure using the same'20107,605,094'Method of forming metal oxide using an atomic layer deposition process'20097,582,573'Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same'20097,517,815'Spin-on glass composition, method of preparing the spin-on glass composition and method of forming a porous silicon oxide layer using the spin-on glass composition'20097,488,684'Organic aluminum precursor and method of forming a metal wire using the same'20097,452,569'Organic aluminum precursor and method of manufacturing a metal wiring using the same'20087,427,573'Forming composite metal oxide layer with hafnium oxide and titanium oxide'20087,270,886'Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same'20077,250,379'Method of forming metal oxide using an atomic layer deposition process'20077,179,537'Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same'20077,053,005'Method of forming a silicon oxide layer in a semiconductor manufacturing process'20066,830,134'Snow chain mechanism for a vehicle'20046,706,646'Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same'20046,479,405'Method of forming silicon oxide layer in semiconductor manufacturing process using spin-on glass composition and isolation method using the same method'20025,419,060'Shoe with detachable heel structure'19955,373,649'Sports shoes having exchangeable heels'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (36)· patent assignee history
2004–2018Based in Kyungki-do, KR· patent location history
2006–2010Based in Seoul, KR· patent location history
2008–2018Based in Seongnam-si, KR· patent location history
2010–2014Patents assigned to CHEIL IND INC (8)· patent assignee history
2011–2020Based in Suwon-si, KR· patent location history
2012–2016Patents assigned to CHOI JUNG-SIK (7)· patent assignee history
2012–2014Patents assigned to LEE CHANG-MIN (3)· patent assignee history
2012–2014Based in Uiwang-si, KR· patent location history
2014–2016Patents assigned to ADEKA CORP (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD362002–2020
CHEIL IND INC82010–2014
CHOI JUNG-SIKself72012–2016
ADEKA CORP42014–2016
LEE CHANG-MIN32012–2014
Locations
LocationPatentsSpan
Seongnam-si, KR192008–2018
Seoul, KR72006–2010
Suwon-si, KR52011–2020
Kyungki-do, KR32004–2018
Uiwang-si, KR32012–2014