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Inventor

Keiichiro Imamura

Inventor
Kanagawa, JP

Overview

3→
Patents
2005–2009
Patent span
General tagging of new technological developments
Primary field (CPC Y)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
Y02PClimate change mitigation technologies in the production or processing of goods25%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
7,490,403'Soldering method'20097,176,388'Soldering method and solder joint member'20076,902,102'Soldering method and solder joint member'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2009Patents assigned to NIPPON DENNETSU KEIKI KK (3)· patent assignee history
2005Based in Yokohama, JP· patent location history
2007–2009Based in Kanagawa, JP· patent location history
2009Patents assigned to MARUYA SEISAKUSBO CO LTD (1)· patent assignee history
2009Patents assigned to NEC INFRONTIA CORP (1)· patent assignee history
2009Patents assigned to NEC TOPPAN CIRCUIT SOLUTIONS T (1)· patent assignee history
2009Patents assigned to SOLDERCOAT CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON DENNETSU KEIKI KK32005–2009
MARUYA SEISAKUSBO CO LTD12009
NEC INFRONTIA CORP12009
NEC TOPPAN CIRCUIT SOLUTIONS T12009
SOLDERCOAT CO LTD12009
Locations
LocationPatentsSpan
Kanagawa, JP22007–2009
Yokohama, JP12005