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Inventor

Chia-Yu Hsieh

Inventor
Singapore, SG

Overview

3→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Fprimary
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds20%
D01FChemical features in the manufacture of artificial filaments, threads, fibres, bristles or ribbons20%
H01LSemiconductor devices20%
H01RElectrically-conductive connections20%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation20%
PatentTitleYear
10,991,733Image sensor and method for manufacturing the same202110,003,160Interface module and related method20189,109,066'Method for preparing a flame retardant modified acrylonitrile-based copolymer and a flame retardant fibrous material'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to FORMOSA PLASTICS CORP (1)· patent assignee history
2015Based in Kaohsiung, TW· patent location history
2018Patents assigned to MEDIATEK INC (1)· patent assignee history
2018Based in Taoyuan, TW· patent location history
2021Patents assigned to UNITED MICROELECTRONICS CORP (1)· patent assignee history
2021Based in Singapore, SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FORMOSA PLASTICS CORP12015
MEDIATEK INC12018
UNITED MICROELECTRONICS CORP12021
Locations
LocationPatentsSpan
Singapore, SG12021
Taoyuan, TW12018
Kaohsiung, TW12015