Inventor
KAN-JU LIN
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
B82YSpecific uses or applications of nanostructures10%
C23CCoating metallic material3%
PatentTitleYear
12,568,664Semiconductor device and method of manufacturing thereof202612,538,771Barrier layer for an interconnect structure202612,494,423Semiconductor device including stacked via contact and method for manufacturing the same202512,439,625Semiconductor device structure and method for forming the same202512,310,050Semiconductor structure and method of forming the same202512,272,621Buried conductive structure in semiconductor substrate202512,255,070Semiconductor devices and methods of manufacturing202512,002,867Contact structure for semiconductor device202411,222,818Formation method of semiconductor device structure with metal-semiconductor compound region2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2026 |