LexDanaLexDanabeta
Inventor

Soon Lock Goh

Inventor
Malacca, MY

Overview

2→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
C09DCoating compositions, e.g. paints, varnishes or lacquers17%
C23CCoating metallic material17%
PatentTitleYear
11,081,417Manufacturing a package using plateable encapsulant202110,453,785Semiconductor device and method of forming double-sided fan-out wafer level package2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to STATS CHIPPAC LTD (1)· patent assignee history
2019Patents assigned to STATS CHIPPAC PTE LTD (1)· patent assignee history
2019Based in Singapore, SG· patent location history
2021Patents assigned to INFINEON TECHNOLOGIES AG (1)· patent assignee history
2021Based in Malacca, MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG12021
STATS CHIPPAC LTD12019
STATS CHIPPAC PTE LTD12019
Locations
LocationPatentsSpan
Malacca, MY12021
Singapore, SG12019