Inventor
Richard D. Emery
Inventor
Chandler, AZ, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests25%
PatentTitleYear
7,952,190'Fabrication of microelectronic devices'20117,531,429'Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices'20097,095,111'Package with integrated wick layer and method for heat removal'20067,091,108'Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2011Patents assigned to INTEL CORP (4)· patent assignee history
2006–2011Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2006–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 4 | 2006–2011 |