Inventor
WAN HSUAN HSU
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,112,953Semiconductor devices and methods of manufacturing202411,923,199Method and structure of middle layer removal202411,776,818Semiconductor devices and methods of manufacturing202311,398,380Method and structure of middle layer removal202211,282,750Contact structure and method of fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2024 |