Inventor

JUN ZENG

Inventor
US

Overview

80→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 80 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering16%
B29CShaping or joining of plastics14%
G06TImage data processing or generation, in general8%
LOC028%
G06FElectric digital data processing7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
B22FWorking metallic powder6%
G05BControl or regulating systems in general6%
G06NComputing arrangements based on specific computational models6%
H01LSemiconductor devices2%
PatentTitleYear
12,590,080Compounds202612,570,614Phenyl amino pyrimidine compounds and uses thereof2026D1116352Garment202612,573,025Cell alignment metric detection method, controller, detection system and storage medium202612,547,148Displacement maps2026D1109978Garment202612,523,983Point cloud alignment2026D1107374Body pants2025D1104408Shapewear2025D1103560Article of clothing2025D1103561Garment2025D1103563Article of clothing2025D1103562Ribbon shaping bodycare jumpsuit2025D1103559Jumpsuit202512,487,580Thermal image determination202512,459,041Porosity prediction2025D1097456Body shaping garment2025D1097455Shaping body suit2025D1096070Shaping garment2025D1096069Shaping jumpsuit2025D1092905Body pants2025D1092906Article of clothing2025D1092004Article of clothing202512,373,618Adaptive simulation in additive manufacturing202512,350,887Adaptive thermal diffusivity2025D1081073Body shaping pants202512,284,817Trench-gated heterostructure and double-heterostructure active devices2025D1070231Body shaping garment2025D1070233Body shaping garment2025D1070232Body shaping garment2025D1070234Body shaping garment202512,229,890Model prediction2025D1055901Electronic device holder202412,166,747Management of secret information202412,145,319Temperature prediction in three-dimensional (3D) parts202412,125,187Enhancing interpolated thermal images202412,057,482MOSFET with distributed doped P-shield zones under trenches202412,026,923Object model encodings202411,975,483Part packing202411,969,949Custom three-dimensional (3D) print mode generation202411,971,689Object manufacturing visualization202411,971,699Thermal mapping202411,967,037Object deformation determination202411,931,967Material phase detection in additive manufacturing202411,914,932User-assisted parts packing optimization202411,897,868Heterocyclic inhibitors of PCSK9202411,888,047Lateral transistors and methods with low-voltage-drop shunt to body diode202411,878,464Predicting thermal behavior in 3D printers202411,872,765Generation of designs for multi-functional objects202411,865,769Weak material phases2024D1010714Selfie stick with remote control202411,741,261Requests and compute resources202311,738,516Three dimensional model categories202311,726,449Packing arrangement determination for 3D printing of objects202311,699,272Generating fluidic components202311,670,328Disk-drive suspension, electronic component, and connection method of suspension and electronic component202311,669,057Neural network thermal behavior predictions2023D0985040Tripod202311,597,156Monitoring additive manufacturing202311,565,473Propagation of a material through an interior volume of a three-dimensional object202311,518,104Manufacturing boundary object shells202211,511,534Identifying passes of additive manufacturing processes depicted in thermal images202211,511,492Three-dimensionally printed object202211,440,2603D printer fresh and recycled powder supply management202211,426,943Selection of powder control temperature regions in 3D printing202211,420,3963D object parts and cage fabrication202211,409,261Predicting distributions of values of layers for three-dimensional printing202211,376,793Printing production quality prediction202211,376,796Adapting printing parameters during additive manufacturing processes202211,340,5973-D printing batch analysis202211,338,521Parts packing for a build volume202211,335,0733D print selection based on voxel property association and conflict resolution202211,335,074Arrangement determination for 3D fabricated parts202211,316,021High density power device with selectively shielded recessed field plate202211,289,596Split gate power device and its method of fabrication202211,275,353Creating a voxel representation of a three dimensional (3-D) object202211,222,463Three-dimensional object representation202211,214,148Distributed high-frequency AC electrical system for the electric vehicle202211,147,797Photodynamic therapeutic compounds and photodynamic methods of treatment202111,135,775Printhead cleaning system2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (37)· patent assignee history
2021–2026Based in US· patent location history
2021–2026Based in AU· patent location history
2022–2024Patents assigned to INST ATLANTICO (7)· patent assignee history
2022–2026Based in CN· patent location history
2023Based in JP· patent location history
2025–2026Patents assigned to Shapellx Us Inc (9)· patent assignee history
2025–2026Patents assigned to POPILUSH LLC (7)· patent assignee history
2025–2026Patents assigned to PERIDOT PRINT LLC (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO372021–2025
Shapellx Us Inc92025–2026
INST ATLANTICO72022–2024
POPILUSH LLC72025–2026
PERIDOT PRINT LLC62025–2026
Locations
LocationPatentsSpan
US652021–2026
CN102022–2026
AU42021–2026
JP12023