Inventor
Je-Young Chang
Inventor
Phoenix, AZ, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices13%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application11%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact7%
G06FElectric digital data processing7%
Y10TTechnical subjects covered by former us classification5%
B82YSpecific uses or applications of nanostructures4%
F25BRefrigeration machines, plants or systems4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,727,160Thermal management component202010,600,699Apparatus for inspection of a package assembly with a thermal solution202010,468,331Heat management system201910,228,735Methods of direct cooling of packaged devices and structures formed thereby20199,686,888'Heat dissipation lid having direct liquid contact conduits'20179,574,832'Enabling an aluminum heat exchanger with a working fluid'20179,477,275'Thermal management solution for circuit products'20168,673,626'Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof'20147,592,697'Microelectronic package and method of cooling same'20097,471,515'Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment'20087,332,314'Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof'20087,317,615'Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment'20087,309,453'Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same'20077,283,360'Enhanced flow channel for component cooling in computer systems'20077,259,965'Integrated circuit coolant microchannel assembly with targeted channel configuration'20077,243,705'Integrated circuit coolant microchannel with compliant cover'20077,131,487'Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers'20067,123,479'Enhanced flow channel for component cooling in computer systems'20067,104,313'Apparatus for using fluid laden with nanoparticles for application in electronic cooling'20066,867,977'Method and apparatus for protecting thermal interfaces'20056,621,698'Computer assembly providing cooling for more than one electronic component'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2020Patents assigned to INTEL CORP (19)· patent assignee history
2003–2007Based in San Jose, CA, US· patent location history
2007–2020Based in Phoenix, AZ, US· patent location history
2008–2014Patents assigned to ALL MEDICUS CO LTD (2)· patent assignee history
2008–2014Based in Anyang-si, KR· patent location history
2014–2017Patents assigned to CHANG JE-YOUNG (3)· patent assignee history
2016Patents assigned to CETEGEN EDVIN (1)· patent assignee history
2016Patents assigned to CHOUDHURY ARNAB (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 19 | 2003–2020 |
| CHANG JE-YOUNGself | 3 | 2014–2017 |
| ALL MEDICUS CO LTD | 2 | 2008–2014 |
| CETEGEN EDVIN | 1 | 2016 |
| CHOUDHURY ARNAB | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 13 | 2007–2020 |
| San Jose, California, US | 6 | 2003–2007 |
| Anyang-si, KR | 2 | 2008–2014 |