Inventor
JING HONG HUANG
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices29%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,347,683Method of manufacturing a semiconductor device202512,148,610Spin on carbon composition and method of manufacturing a semiconductor device202412,074,027Underlayer of multilayer structure and methods of use thereof202411,955,336Method of manufacturing a semiconductor device202411,728,161Spin on carbon composition and method of manufacturing a semiconductor device202311,703,766Materials and methods for forming resist bottom layer202311,476,108Spin on carbon composition and method of manufacturing a semiconductor device202211,442,364Materials and methods for forming resist bottom layer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2025 |