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Inventor

Pai-Yi Chiu

Inventor
Hsinchu, TW

Overview

3→
Patents
2018–2021
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables29%
G06FElectric digital data processing29%
H04LTransmission of digital information, e.g. telegraphic communication29%
H05KPrinted circuits14%
PatentTitleYear
10,963,024Combination parallel path heatsink and EMI shield202110,447,488Device and method for detecting powered devices connected to a power source equipment in a power over ethernet system201910,142,116Inspection device and method for powered devices in a power over Ethernet system2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2019Patents assigned to IC PLUS CORP (2)· patent assignee history
2018–2019Based in Hsinchu, TW· patent location history
2021Patents assigned to APPLE INC (1)· patent assignee history
2021Based in Campbell, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IC PLUS CORP22018–2019
APPLE INC12021
Locations
LocationPatentsSpan
Hsinchu, TW22018–2019
Campbell, California, US12021