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Inventor

YUJUAN TAO

Inventor
CN

Overview

2→
Patents
2025–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,564,083Packaging structure having semiconductor chips and encapsulation layers and formation method thereof202612,438,098Packaging structure and fabrication method thereof2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025–2026Patents assigned to NANTONG TONGFU MICROELECTRONICS CO LTD (2)· patent assignee history
2025–2026Patents assigned to TONGFU MICROELECTRONICS CO LTD (2)· patent assignee history
2025–2026Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NANTONG TONGFU MICROELECTRONICS CO LTD22025–2026
TONGFU MICROELECTRONICS CO LTD22025–2026
Locations
LocationPatentsSpan
CN22025–2026