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Inventor

Lilia May

Inventor
Chandler, AZ, US

Overview

4→
Patents
2017–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,685,850High density organic interconnect structures202010,573,622Methods of forming joint structures for surface mount packages202010,049,971Package structure to enhance yield of TMI interconnections20189,613,933'Package structure to enhance yield of TMI interconnections'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2020Patents assigned to INTEL CORP (4)· patent assignee history
2017Patents assigned to ARAVAMUDHAN SRINIVASA R (1)· patent assignee history
2017Patents assigned to DANI ASHAY A (1)· patent assignee history
2017Patents assigned to DE BONIS THOMAS J (1)· patent assignee history
2017Patents assigned to DEPPISCH CARL L (1)· patent assignee history
2017–2020Based in Chandler, AZ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP42017–2020
ARAVAMUDHAN SRINIVASA R12017
DANI ASHAY A12017
DE BONIS THOMAS J12017
DEPPISCH CARL L12017
Locations
LocationPatentsSpan
Chandler, AZ, US42017–2020