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Inventor

HENG-JEN LEE

Inventor
TW

Overview

3→
Patents
2021–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
F27BFurnaces, kilns, ovens or retorts in general13%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace13%
B67DDispensing, delivering or transferring liquids, not otherwise provided for7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
12,196,491Adaptive baking method202512,025,917System and method for supplying and dispensing bubble-free photolithography chemical solutions202411,204,200Adaptive baking method2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2021–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32021–2025
Locations
LocationPatentsSpan
TW32021–2025